公开(公告)号：US20230138324A1

公开(公告)日：2023-05-04

申请号：US17902912

申请日：2022-09-05

Applicant: MEDIATEK INC.

Inventor： Yu-Cheng Liao ,  Bo-Shih Huang ,  Che-Yuan Jao ,  Yi-Chieh Lin

IPC: H01L23/60 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: The present invention provides a package including a first pad, a die and at least one package ESD component is disclosed. The first pad is configured to receive a signal from a device external to the package. The die comprises a second pad and an internal circuit, wherein the internal circuit is configured to receive the signal from the first pad via the second pad. The at least one ESD component is positioned outside the die.