公开(公告)号：US11869831B2

公开(公告)日：2024-01-09

申请号：US17460352

申请日：2021-08-30

Applicant: MEDIATEK INC.

Inventor： Chin-Chiang Chang ,  Yin-Fa Chen ,  Shih-Chin Lin

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49541 ,  H01L23/3107 ,  H01L23/49503 ,  H01L24/48 ,  H01L2224/48175

Abstract: A semiconductor package includes a die attach pad, a plurality of lead terminals positioned about the die attach pad and disposed along side edges of the semiconductor package, a semiconductor die mounted on the die attach pad, a molding compound encapsulating the plurality of lead terminals and the semiconductor die, and at least one dummy lead disposed in a corner region of the semiconductor package between the plurality of lead terminals.

公开(公告)号：US20220115303A1

公开(公告)日：2022-04-14

申请号：US17460352

申请日：2021-08-30

Applicant: MEDIATEK INC.

Inventor： Chin-Chiang Chang ,  Yin-Fa Chen ,  Shih-Chin Lin

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a die attach pad, a plurality of lead terminals positioned about the die attach pad and disposed along side edges of the semiconductor package, a semiconductor die mounted on the die attach pad, a molding compound encapsulating the plurality of lead terminals and the semiconductor die, and at least one dummy lead disposed in a corner region of the semiconductor package between the plurality of lead terminals.