公开(公告)号：US20240404924A1

公开(公告)日：2024-12-05

申请号：US18732584

申请日：2024-06-03

Applicant: MEDIATEK INC.

Inventor： Tsung-Ming Chen ,  Yu-Ting Chou ,  Keng-Chang Liang ,  Chiyuan Lu ,  Jing-Hong Conan Zhan

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

Abstract: A semiconductor package includes a leadframe having a die pad and lead terminals along a perimeter of the die pad, and an IC die mounted on the die pad. The IC die includes I/O pads disposed on an active front surface of the IC die. The IC die includes a semiconductor substrate, a circuit block fabricated on the semiconductor substrate, and a through substrate via (TSV) extending through a thickness of the semiconductor substrate. Bond wires extend between the I/O pads and the lead terminals, respectively. A molding compound encapsulates the IC die, the bond wires, and the leadframe.