公开(公告)号：US3567844A

公开(公告)日：1971-03-02

申请号：US3567844D

申请日：1969-06-23

Applicant: MC DONNELL DOUGLAS CORP

Inventor： KRCMAR LUDWIG L

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/34 ,  H05K3/32

CPC classification number: H05K3/3447 ,  H05K1/092 ,  H05K1/116 ,  H05K3/3468 ,  H05K2201/09463 ,  H05K2203/044

Abstract: Printed terminal pad structure is formed on a circuit board or substrate surface around and adjacent to the periphery of a terminal pin opening, the pad structure being characterized by a radially extending slot of appropriate width therein to prevent the pin opening from being plugged during a subsequent dip soldering process when a coating of solder is applied to the exposed surface of the pad structure. A solder-coated terminal pad around a solder-free terminal pin opening is thus obtained from the printed terminal pad structure.