公开(公告)号：US12224182B2

公开(公告)日：2025-02-11

申请号：US18176222

申请日：2023-02-28

Applicant: Lumileds LLC

Inventor： Tze Yang Hin ,  Anantharaman Vaidyanathan ,  Srini Banna ,  Ronald Johannes Bonne

IPC: H01L21/48 ,  F21S41/153 ,  F21V23/00 ,  F21Y105/10 ,  F21Y105/16 ,  F21Y115/10 ,  H01L21/683 ,  H01L23/00 ,  H01L25/16 ,  H01L27/15 ,  H01L33/62

Abstract: Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.

公开(公告)号：US11621173B2

公开(公告)日：2023-04-04

申请号：US16750839

申请日：2020-01-23

Applicant: Lumileds LLC

Inventor： Tze Yang Hin ,  Anantharaman Vaidyanathan ,  Srini Banna ,  Ronald Johannes Bonne

IPC: H01L21/48 ,  H01L33/62 ,  H01L27/15 ,  H01L21/683 ,  H01L23/00 ,  H01L25/16 ,  F21V23/00 ,  F21S41/153 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y105/16

Abstract: Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.

公开(公告)号：US11631594B2

公开(公告)日：2023-04-18

申请号：US16750824

申请日：2020-01-23

Applicant: Lumileds LLC

Inventor： Tze Yang Hin ,  Anantharaman Vaidyanathan ,  Srini Banna ,  Ronald Johannes Bonne

IPC: H01L21/48 ,  F21V23/00 ,  H01L33/62 ,  F21S41/153 ,  H01L27/15 ,  H01L21/683 ,  H01L23/00 ,  H01L25/16 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y105/16

Abstract: Methods of manufacturing a system are described. A method includes attaching a silicon backplane to a carrier and molding the silicon backplane on the carrier such that a molding material surrounds side surfaces of the silicon backplane to form a structure comprising a substrate with an embedded silicon backplane. The structure has a first surface opposite the carrier, a second surface adjacent the carrier, and side surfaces. At least one via is formed through the molding material and filled with a metal material. A metal layer is formed on a central region of the first surface of the structure. Redistribution layers are formed on the first surface of the structure adjacent the metal layer.

公开(公告)号：US11156346B2

公开(公告)日：2021-10-26

申请号：US16750809

申请日：2020-01-23

Applicant: Lumileds LLC

Inventor： Tze Yang Hin ,  Anantharaman Vaidyanathan ,  Srini Banna ,  Ronald Johannes Bonne

IPC: F21V23/00 ,  F21S41/153 ,  H01L27/15 ,  H01L33/62 ,  F21Y105/10 ,  F21Y115/10

Abstract: LED lighting systems and vehicle headlamp systems are described. An LED lighting system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface and side surfaces. First redistribution layers are provided on the top surface of the silicon backplane and the top surface of the substrate. Second redistribution layers are provided on the bottom surface of the silicon backplane and the bottom surface of the substrate. At least one via extends through the substrate between the first redistribution layers and the second redistribution layers and is filled with a metal material.

公开(公告)号：US11125425B2

公开(公告)日：2021-09-21

申请号：US16750809

申请日：2020-01-23

Applicant: Lumileds LLC

Inventor： Tze Yang Hin ,  Anantharaman Vaidyanathan ,  Srini Banna ,  Ronald Johannes Bonne

IPC: F21V23/00 ,  F21S41/153 ,  H01L27/15 ,  H01L33/62 ,  F21Y105/10 ,  F21Y115/10

Abstract: LED lighting systems and vehicle headlamp systems are described. An LED lighting system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface and side surfaces. First redistribution layers are provided on the top surface of the silicon backplane and the top surface of the substrate. Second redistribution layers are provided on the bottom surface of the silicon backplane and the bottom surface of the substrate. At least one via extends through the substrate between the first redistribution layers and the second redistribution layers and is filled with a metal material.