公开(公告)号：US20240283218A1

公开(公告)日：2024-08-22

申请号：US18315400

申请日：2023-05-10

Applicant: Lumentum Operations LLC

Inventor： Yeyu ZHU ,  Eric R. HEGBLOM ,  Slava KHASSINE

IPC: H01S5/042 ,  H01S5/02 ,  H01S5/0236 ,  H01S5/0237 ,  H01S5/42

CPC classification number: H01S5/04256 ,  H01S5/0217 ,  H01S5/0236 ,  H01S5/0237 ,  H01S5/423

Abstract: A vertical-cavity surface-emitting laser (VCSEL) array may include a substrate, a wafer bonding layer over the substrate, and a first metal layer on or within the wafer bonding layer. The first metal layer may include a plurality of first electrodes. The VCSEL array may include an epitaxial region over the first metal layer and the wafer bonding layer. The epitaxial region may be bonded to the wafer bonding layer. The VCSEL array may include a second metal layer over the epitaxial region. The second metal layer may include a plurality of second electrodes. The plurality of first electrodes and the plurality of second electrodes may form a plurality of matrix addressable subarrays of the VCSEL array, where each matrix addressable subarray of the plurality of matrix addressable subarrays includes one or more emitters.

公开(公告)号：US20190067901A1

公开(公告)日：2019-02-28

申请号：US16102096

申请日：2018-08-13

Applicant: Lumentum Operations LLC

Inventor： Slava KHASSINE ,  Lucas Morales ,  Joseph Leigh

IPC: H01S5/022 ,  H01S5/42 ,  H01S5/02 ,  H01S5/024

Abstract: An optical device may include a substrate and a plurality of optical components. he plurality of optical components may include a laser driver. The plurality of optical components may include a laser diode. The plurality of optical components may be encapsulated by an encapsulation material and the substrate.