公开(公告)号：US20220200232A1

公开(公告)日：2022-06-23

申请号：US17192470

申请日：2021-03-04

Applicant: Lumentum Operations LLC

Inventor： Albert YUEN ,  Mitchell SRIMONGKOL ,  Joseph LIN

IPC: H01S5/0234

Abstract: In some implementations, an optical device for mounting in a flip-chip configuration includes a plurality of flip-chip bumps that are arranged in a pattern on the optical device, wherein the pattern is not aligned with a crystal cleavage plane associated with a substrate of the optical device. In some implementations, the optical device further includes a gap that separates a primary region of the optical device and a secondary region of the optical device, wherein at least one portion of a side of the gap is oriented at a non-zero angle to the crystal cleavage plane.