公开(公告)号：US10962726B2

公开(公告)日：2021-03-30

申请号：US16700121

申请日：2019-12-02

Applicant: Lumentum Operations LLC

Inventor： Frank Wu ,  Prasad Yalamanchili ,  Raman Srinivasan ,  Huijie Xu

IPC: G02B6/42 ,  C09J5/00 ,  C09J163/00

Abstract: A fiber attachment structure may comprise a monolithic platform structure having a first trench and a second trench to segment the monolithic platform structure into a chip mount area, a first island, and a second island. A laser chip may be mounted directly on the chip mount area and an optical fiber may be mounted on the first island by a first adhesive joint and on the second island by a second adhesive joint. For example, in some implementations, the first adhesive joint may include a first quantity of adhesive material attaching the optical fiber to the first island at a position at which a tip of the optical fiber is aligned with an output facet of the laser chip, and the second adhesive joint may include a second quantity of the adhesive material to mechanically secure the optical fiber to the second island.