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公开(公告)号:US20240290899A1
公开(公告)日:2024-08-29
申请号:US18569896
申请日:2022-06-24
IPC分类号: H01L31/049 , H01L31/05
CPC分类号: H01L31/049 , H01L31/0516
摘要: The invention relates to a solar module with improved bonding. The solar module (100) comprises a front encapsulant layer (104), solar cells (106), a middle encapsulant layer (108), a back contact foil (210b) with a patterned copper pattern (210b) thereon, and a back encapsulant layer (112). Inventors found that, when producing such a solar module, the bonding between the middle encapsulant layer and the copper side of the back contact foil was insufficient. A solution is found in providing cut-outs in the back contact foil through which the back encapsulant layer can bond to the middle encapsulant layer and/or the solar cells.
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公开(公告)号:US20240213394A1
公开(公告)日:2024-06-27
申请号:US18555833
申请日:2022-04-14
IPC分类号: H01L31/18 , H01L31/048 , H01L31/05
CPC分类号: H01L31/18 , H01L31/0481 , H01L31/0516
摘要: The invention pertains to a method for laminating solar cells, comprising: attaching a first side encapsulant (114) to solar cells, which first side encapsulant is made of a first encapsulant material, the first side encapsulant being attached to one of the photosensitive side and the backside of the solar cells forming at least a part of a stack by, after attaching the first side encapsulant to the solar cells, attaching a second side encapsulant (112) to the other one of the photosensitive side and the backside of the solar cells, the second side encapsulant (114) being made of a second encapsulant material which is different from the first encapsulant material, and wherein the first encapsulant material has a change of dimensions which is less than the change of dimensions of the second encapsulant material.
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