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公开(公告)号：US20210217168A1
公开(公告)日：2021-07-15
申请号：US17143281
申请日：2021-01-07
Applicant: Leica Microsystems CMS GmbH
Inventor： Falk SCHLAUDRAFF , Christoph GREB
IPC: G06T7/00
Abstract: A method for checking a dissection process in a laser microdissection system includes carrying out the dissection process for cutting out a dissectate from an object in a first region of the object by a laser beam. First image data is acquired of at least the first region of the object after the dissection process. It is examined whether the first image data has sharp structures within a region to be separated by the dissection process in order to determine whether the dissection process was successful.
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