公开(公告)号：US20190297689A1

公开(公告)日：2019-09-26

申请号：US16182780

申请日：2018-11-07

Applicant: LG Electronics Inc.

Inventor： Hoon Seob SIM ,  Jaekyung YANG ,  Se Mi LEE ,  Yongsoo LEE ,  Hakjoo LIM

IPC: H05B6/42 ,  F28D15/02 ,  F04D13/06 ,  F04D29/60

Abstract: An induction heating device includes a casing; a first induction heating module in the casing; a first heat sink located below the first induction heating module; a first heat pipe that passes through the first heat sink, that extends outward from the first induction heating module, and that is configured to discharge heat from the first heat sink out of the first induction heating module; an air-discharge fan located at an inner side of the casing and configured to discharge air from inside of the casing to outside of the casing; and a cooling fan located at the inner side of the casing and configured to blow air to the air-discharge fan. The first heat pipe has an end that protrudes from the first induction heating module and that is located at an air-flow path defined between the cooling fan and the air-discharge fan.