公开(公告)号：US11521778B2

公开(公告)日：2022-12-06

申请号：US16344767

申请日：2017-10-20

Applicant: LG ELECTRONICS INC.

Inventor： Hyungjun Kim ,  Kyungsoo Hwangbo

IPC: H05B6/36 ,  H05B6/40 ,  H01F17/00 ,  H01F5/00 ,  H05K1/16 ,  H05B6/44

Abstract: The coil substrate may include a substrate; a first conductor layer including a plurality of first and second segments periodically disposed on a top and a bottom of the substrate; a second conductor layer including a plurality of first and second segments periodically overlapping the first conductor layer on the top and the bottom of the substrate; a first connection line that connects the first and second segments of the first conductor layer; and a second connection line that connects the first and second segments of the second conductor layer. The first connection line includes a first region exposed on at least one of first and second surfaces that are opposite to each other of the substrate and second and third regions disposed through the substrate from both sides of the first region.