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    COMPRESSOR AND CHILLER SYSTEM INCLUDING SAME
    1.
    发明申请
    COMPRESSOR AND CHILLER SYSTEM INCLUDING SAME 审中-公开

    公开(公告)号：US20190277300A1

    公开(公告)日：2019-09-12

    申请号：US16329180

    申请日：2016-10-21

    Applicant: LG ELECTRONICS INC.

    Inventor： Kiwook LEE ,  Seongmin JANG ,  Jinhee JEONG ,  Chanmyung PARK ,  Solji RYU

    IPC: F04D29/058 ,  F04D29/056 ,  F25B31/02

    Abstract: The present invention relates to a compressor and a chiller system including the compressor, the compressor comprising: one or more impellers for suctioning a refrigerant in an axial direction and compressing the same in a centrifugal direction; a rotary shaft formed so as to rotate the impeller; a collar coupled to the rotary shaft so as to extend outward in the radial direction of the rotary shaft; a thrust magnetic bearing formed so as to support the collar by means of a magnetic field, thereby preventing axial movement of the rotary shaft; and a mechanical backup bearing formed so as to prevent axial movement of the rotary shaft, wherein the backup bearing is disposed so as to overlap a portion of the thrust magnetic bearing in the radial direction of the rotary shaft.

    REFRIGERATOR
    2.
    发明申请
    REFRIGERATOR 有权

    公开(公告)号：US20210116155A1

    公开(公告)日：2021-04-22

    申请号：US17253213

    申请日：2019-07-10

    Applicant: LG ELECTRONICS INC.

    Inventor： Kiwook LEE ,  Namsoo LEE ,  Chanmyung PARK

    IPC: F25B31/00 ,  F28F3/12

    Abstract: A refrigerator according to an embodiment of the present invention includes: a compressor configured to compress a refrigerant; and an inverter module configured to control the compressor, wherein the inverter module includes: a heatsink provided with a cooling passage through which coolant passes; a coolant inlet connected to the heatsink to communicate with an inlet of the cooling passage; a coolant outlet connected to the heatsink to communicate with an outlet of the cooling passage; at least one insulated gate bipolar transistor (IGBT) disposed on a top surface of the heatsink; and at least one diode disposed to be spaced apart from the IGBT on the top surface of the heatsink, wherein the cooling passage includes: an IGBT cooling passage that is closer to the coolant inlet among the coolant inlet and the coolant outlet; and a diode cooling passage that is closer to the coolant outlet among the coolant inlet and the coolant outlet, wherein the diode cooling passage is disposed behind the IGBT cooling passage in a flow direction of the coolant.

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