公开(公告)号：US11804585B2

公开(公告)日：2023-10-31

申请号：US17042867

申请日：2018-09-10

Applicant: LG ELECTRONICS INC.

Inventor： Bongseok Choi ,  Mingu Kang ,  Hooyoung Song

IPC: H01L33/62 ,  F21S43/14 ,  F21S41/141 ,  H01L27/15 ,  H01L33/00 ,  H01L33/38 ,  H01L33/44

CPC classification number: H01L33/62 ,  F21S41/141 ,  F21S43/14 ,  H01L27/156 ,  H01L33/005 ,  H01L33/382 ,  H01L33/44 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0066

Abstract: Discussed is a lamp and a lamp device, and more particularly, to a lamp using a semiconductor light-emitting device, and a method of manufacturing the lamp. The lamp includes a substrate; a plurality of semiconductor light-emitting devices disposed on the substrate; a flat layer formed between the plurality of semiconductor light-emitting devices; a spacer disposed between the substrate and the flat layer; and an air gap disposed between each semiconductor light-emitting device and the spacer.

公开(公告)号：US12300672B2

公开(公告)日：2025-05-13

申请号：US17616553

申请日：2019-06-12

Applicant: LG ELECTRONICS INC.

Inventor： Bongseok Choi

IPC: H01L25/00 ,  H01L25/075 ,  H10H20/01 ,  H10H20/857

Abstract: A method for manufacturing a display device can include growing a plurality of light emitting (LEDs) on a growing substrate; forming a member having a thermal flow characteristic on at least one side surface of each of the plurality of LEDs; separating each of the plurality of LEDs from the growing substrate; forming a plurality of assembly grooves in a wiring substrate for defining pixel regions; assembling the plurality of LEDs at locations respectively corresponding to the plurality of assembly grooves; and applying heat to the wiring substrate to perform a reflow process for adjusting a position of at least one of the plurality of LEDs.