公开(公告)号：US20230271901A1

公开(公告)日：2023-08-31

申请号：US18017716

申请日：2021-08-27

申请人： LG CHEM, LTD.

发明人： Dai Seung CHOI ,  Seungyeon HWANG ,  Dongmin JEONG ,  Bethy KIM

IPC分类号： C07C15/28 ,  C07B59/00 ,  C07C15/24 ,  C07D307/91 ,  C07C17/395 ,  C07C37/86 ,  H10K85/60

CPC分类号： C07C15/28 ,  C07B59/001 ,  C07B59/002 ,  C07C15/24 ,  C07D307/91 ,  C07C17/395 ,  C07C37/86 ,  H10K85/626 ,  H10K85/6574 ,  C07B2200/05 ,  C07C2602/10 ,  C07C2603/24 ,  C07C2603/42

摘要： Provided is a method for producing a deuterated aromatic compound and a deuterated reaction composition. The method includes performing a deuterated reaction of an aromatic compound including one or more hydrocarbon aromatic rings using a solution comprising heavy water, an organic compound which can be hydrolyzed by the heavy water, the aromatic compound, and an organic solvent. The method has an advantage in that impurities due to hydrogen gas are not generated, the deuterium substitution rate is high, and the deuterated reaction can be performed under a lower pressure and a lower temperature.

公开(公告)号：US20230286882A1

公开(公告)日：2023-09-14

申请号：US18017732

申请日：2021-08-27

申请人： LG CHEM, LTD.

发明人： Dongmin JEONG ,  Dai Seung CHOI ,  Seungyeon HWANG ,  Bethy KIM

IPC分类号： C07B59/00 ,  C07C15/24 ,  H10K85/60 ,  C07C15/28 ,  C07C25/22 ,  C07F5/02 ,  H10K85/30 ,  C07D209/86 ,  C07D307/91 ,  C07D333/76

CPC分类号： C07B59/002 ,  C07C15/24 ,  H10K85/615 ,  C07C15/28 ,  C07C25/22 ,  C07F5/025 ,  H10K85/322 ,  C07D209/86 ,  H10K85/6572 ,  C07D307/91 ,  H10K85/6574 ,  C07D333/76 ,  H10K85/6576 ,  C07B59/001 ,  C07B2200/05 ,  C07C2603/24 ,  H10K50/11

摘要： Provided is a method for producing a deuterated aromatic compound and a deuterated reaction composition. The method includes performing a deuterated reaction of an aromatic compound comprising one or more aromatic rings using a solution comprising the aromatic compound, heavy water, and an organic compound which can be hydrolyzed by the heavy water. The method produces a high-purity deuterated compound under relatively low temperature and pressure conditions.