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公开(公告)号：US20250070071A1
公开(公告)日：2025-02-27
申请号：US18810723
申请日：2024-08-21
Applicant: LAPIS Technology Co., Ltd.
Inventor： Daisuke TAKAGI
IPC: H01L23/00 , H01L21/56 , H01L23/31 , H01L23/495 , H01L25/065
Abstract: A semiconductor device including: a semiconductor chip including redistribution wiring; a lead frame including a die pad mounted with the semiconductor chip and a lead connected to the die pad, wherein the redistribution wiring and the die pad are electrically connected by a solder or a conductive adhesive; and a sealing member that seals the semiconductor chip.
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