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公开(公告)号:US11543157B2
公开(公告)日:2023-01-03
申请号:US15734643
申请日:2020-10-14
发明人: Heon Lee , Pil-Hoon Jung , Soomin Son , Dongwoo Chae , Yuting Liu
IPC分类号: F24S70/25 , F24S50/80 , F24S70/225 , F24S70/60
摘要: A radiative cooling device, and a method of manufacturing the same, includes a reflective layer disposed on a substrate and responsible for reflecting sunlight having wavelengths corresponding to ultraviolet, visible, and near-infrared regions; and a radiative cooling layer disposed on the reflective layer and responsible for absorbing sunlight having a wavelength corresponding to a mid-infrared region and emitting the sunlight as heat, wherein the radiative cooling layer includes a first radiation layer including an uneven pattern; and a second radiation layer disposed on the first radiation layer and having a refractive index different from that of the first radiation layer.