公开(公告)号：US11884759B2

公开(公告)日：2024-01-30

申请号：US17541023

申请日：2021-12-02

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Myong Jae Yoo ,  Churl Seung Lee

IPC: C08F220/58 ,  C08F220/28 ,  C08F222/10 ,  C08F220/18 ,  C08F220/34

CPC classification number: C08F220/58 ,  C08F220/282

Abstract: This application relates to a low-dielectric thermally curable resin composition for solving a problem of increased transmission loss. In one aspect, the low-dielectric thermally curable resin composition includes a (meth)acrylic monomer having an alicyclic heterocycle, a polyfunctional (meth)acrylic monomer, an initiator, and a curing accelerator, and a low dielectric material prepared therefrom. Various embodiments can provide excellent low dielectric properties with a dielectric constant (Dk) in a high frequency area of 1 to 20 GHz of less than, for example, 3.28. In addition, the low dielectric material can have a significantly reduced transmission loss with a dissipation factor (Df) in an area of 1 to 20 GHz of less than, for example, 0.008, and thus, may implement excellent transmission properties in excellent 5G mobile communication.

公开(公告)号：US10515737B2

公开(公告)日：2019-12-24

申请号：US15799810

申请日：2017-10-31

Applicant: Korea Electronics Technology Institute

Inventor： Sung Hyun Kim ,  Ji Sun Park ,  Myong Jae Yoo

IPC: H01B1/22 ,  H05K1/09 ,  C09D5/24 ,  C08K3/38 ,  C08K3/08 ,  H01L31/0224

Abstract: A conductive paste composition, a method for preparing the same, and an electrode formed by the conductive paste composition are disclosed. In one aspect, the conductive paste composition includes a copper-based particle and a boron-based particle of which a surface is partially or entirely coated with boron oxide. The boron-based particle is crystalline boron-based particle or amorphous boron-based particle. The boron-based particle has a content of more than 1 wt % to less than 10 wt % based on a total content of the conductive paste composition.

公开(公告)号：US20190115117A1

公开(公告)日：2019-04-18

申请号：US15799810

申请日：2017-10-31

Applicant: Korea Electronics Technology Institute

Inventor： Sung Hyun Kim ,  Ji Sun Park ,  Myong Jae Yoo

IPC: H01B1/22 ,  H01L31/0224

Abstract: A conductive paste composition, a method for preparing the same, and an electrode formed by the conductive paste composition are disclosed. In one aspect, the conductive paste composition includes a copper-based particle and a boron-based particle of which a surface is partially or entirely coated with boron oxide. The boron-based particle is crystalline boron-based particle or amorphous boron-based particle. The boron-based particle has a content of more than 1 wt % to less than 10 wt % based on a total content of the conductive paste composition.