公开(公告)号：US11732162B2

公开(公告)日：2023-08-22

申请号：US16951466

申请日：2020-11-18

Applicant: Korea Advanced Institute of Science and Technology

Inventor： KyoungWook Paik ,  Jae Hyeong Park

IPC: C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J7/35 ,  C09J7/38 ,  C08K5/42 ,  C08K3/10 ,  C08K5/55

CPC classification number: C09J9/02 ,  C09J7/35 ,  C09J7/385 ,  C09J11/04 ,  C09J11/06 ,  C08K3/10 ,  C08K5/42 ,  C08K5/55 ,  C08K2201/003 ,  C09J2203/326 ,  C09J2301/314 ,  C09J2301/408 ,  C09J2433/00 ,  C09J2463/00

Abstract: Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thermo-compression bonding may include a flux activator, solder particles and polymer resin.