Patent search ap:("Korea Advanced Institute of Science AND Technology") AND inv:"Jae Hyeong PARK" Page 1

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发明申请
ANISOTROPIC CONDUCTIVE ADHESIVES FOR THERMO-COMPRESSION BONDING CONTAINING SOLDER CONDUCTIVE PARTICLES AND FLUX ADDITIVES AND METHOD OF CONNECTING ELECTRONIC PARTS USING THE SAME 有权

公开(公告)号：US20210261829A1

公开(公告)日：2021-08-26

申请号：US16951466

申请日：2020-11-18

Applicant: Korea Advanced Institute of Science and Technology

Inventor： KyoungWook PAIK , Jae Hyeong PARK

IPC: C09J9/02 , C09J11/04 , C09J11/06 , C09J7/35 , C09J7/38

Abstract: Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux aciditives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thereto-compression bonding may include a flux activator, solder particles and polymer resin.

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