-
公开(公告)号:US20210067251A1
公开(公告)日:2021-03-04
申请号:US17010277
申请日:2020-09-02
Inventor: HyoHoon Park , Joonsup Shim , Seonghwan Kim , Hyun-Woo Rhee
Abstract: A device system for constituting a 3D image sensor based on optical phased array is provided. The device system includes an optical modulator that is integrated on the same photonic integrated circuit (PIC) chip as a laser diode array with different output wavelengths and a multiplexer for transmitting an optical wave having a wavelength selected from the laser diode array to an optical waveguide and modulates the optical wave into a specific optical signal, an optical phased array that radiates the optical signal received via an optical switch to the free space using a tunable transmit and receive (TRx) antenna array, and a photodetector that converts an Rx optical signal received by a Tx optical signal transmitted via the optical phased array into an electrical signal.
-
公开(公告)号:US11329725B2
公开(公告)日:2022-05-10
申请号:US17010277
申请日:2020-09-02
Inventor: HyoHoon Park , Joonsup Shim , Seonghwan Kim , Hyun-Woo Rhee
Abstract: A device system for constituting a 3D image sensor based on optical phased array is provided. The device system includes an optical modulator that is integrated on the same photonic integrated circuit (PIC) chip as a laser diode array with different output wavelengths and a multiplexer for transmitting an optical wave having a wavelength selected from the laser diode array to an optical waveguide and modulates the optical wave into a specific optical signal, an optical phased array that radiates the optical signal received via an optical switch to the free space using a tunable transmit and receive (TRx) antenna array, and a photodetector that converts an Rx optical signal received by a Tx optical signal transmitted via the optical phased array into an electrical signal.
-
3.
公开(公告)号:US20170351043A1
公开(公告)日:2017-12-07
申请号:US15239622
申请日:2016-08-17
Inventor: HyoHoon Park , Jong-Hun Kim , Seonghwan Kim
CPC classification number: G02B6/4214 , G02B5/10
Abstract: An optical package according to an embodiment includes a substrate comprising any one of a photodetector or an optical grating coupler and a light source, and a reflector arranged on or over the substrate to reflect light waves radiated from the light source and transmit the reflected light waves to any one of the photodetector or the optical grating coupler.
-
-