公开(公告)号：US20240297420A1

公开(公告)日：2024-09-05

申请号：US18289911

申请日：2022-06-02

申请人： Komatsu Ltd.

发明人： Kenichi Noto ,  Ryo Kawai ,  Shimon Morikawa ,  Ryota Kasama ,  Hiroyuki Mizukami ,  Yasuhiko Matsuki

IPC分类号： H01M50/536 ,  H01G11/06 ,  H01G11/86 ,  H01M10/0525 ,  H01M10/0585

CPC分类号： H01M50/536 ,  H01G11/06 ,  H01G11/86 ,  H01M10/0525 ,  H01M10/0585

摘要： A bonding method includes a step of alternately stacking an electrode foil and a separator and forming a protruding portion extending to extend the stacked electrode foil, and a step of wobbling welding the protruding portion and a collector plate by irradiating an outer surface of the collector plate with laser light in a state in which an inner surface of the collector plate is in contact with the protruding portion.