公开(公告)号：US06234298B1

公开(公告)日：2001-05-22

申请号：US09271320

申请日：1999-03-18

申请人： Kiyoyuki Nakagawa ,  Kenichi Fukuda ,  Isamu Utsunomiya

发明人： Kiyoyuki Nakagawa ,  Kenichi Fukuda ,  Isamu Utsunomiya

IPC分类号： B65G4744

CPC分类号： H05K13/028 ,  B65G47/145 ,  B65G47/1457

摘要： A feeder for electronic chip components is provided having an aligning path forming member agitating electronic chip components which are to be discharged from a discharge opening of a hopper for accommodating a plurality of electronic chip components. The agitation is achieved by reciprocating the aligning path forming member in the axis direction of the discharge opening and forming a tubular aligning path which receives only the electronic chip components aligned in a predetermined direction therein. When the aligning path forming member reciprocates it also rotates around its axis. This results in an increased agitating effect on electronic chip components for guiding them into the aligning path.

摘要翻译： 提供了一种用于电子芯片部件的馈线，具有对准路径形成部件，搅动将从用于容纳多个电子芯片部件的料斗的排出口排出的电子芯片部件。 搅拌是通过使排出路径形成构件在排出口的轴线方向上往复运动而形成一个管状排列路径来实现的，所述管状排列路径只接收沿预定方向排列的电子芯片部件。 当对准路径形成构件往复运动时，其也绕其轴线旋转。 这导致对电子芯片部件的搅拌效果增加，以将它们引导到对准路径中。

公开(公告)号：US06619467B1

公开(公告)日：2003-09-16

申请号：US09287135

申请日：1999-04-07

申请人： Kiyoyuki Nakagawa ,  Kenichi Fukuda ,  Isamu Utsunomiya

发明人： Kiyoyuki Nakagawa ,  Kenichi Fukuda ,  Isamu Utsunomiya

IPC分类号： H05K1302

CPC分类号： H05K13/028

摘要： A feeder for feeding electronic chip components includes a hopper having a discharge opening at its bottom and having and an aligning path forming member for agitating electronic chip components. The aligning path forming member agitates the electronic chip components by its reciprocating movement within the discharge opening of the hopper. The reciprocating stroke of the aligning path forming member can be varied, and the stroke is controlled to be shorter when the number of electronic chip components remaining in the hopper is reduced. This allows the electronic chip components to be guided more reliably into an aligning path formed by the aligning path forming member, regardless of the number of electronic chip components remaining in the hopper.

摘要翻译： 用于馈送电子芯片部件的馈线包括在其底部具有排放开口的料斗，并具有用于搅拌电子芯片部件的对准通路形成部件。 对准路径形成构件通过在料斗的排出口内的往复运动来搅动电子芯片部件。 可以改变对准路径形成构件的往复行程，并且当剩余在料斗中的电子芯片部件的数量减少时，行程被控制得更短。 这允许将电子芯片部件更可靠地引导到由对准路径形成部件形成的对准路径中，而与料斗中剩余的电子芯片部件的数量无关。

公开(公告)号：US06267223B1

公开(公告)日：2001-07-31

申请号：US09271321

申请日：1999-03-18

申请人： Kiyoyuki Nakagawa ,  Kenichi Fukuda ,  Isamu Utsunomiya

发明人： Kiyoyuki Nakagawa ,  Kenichi Fukuda ,  Isamu Utsunomiya

IPC分类号： B65G4714

CPC分类号： B65G47/1407

摘要： At least one partition wall is disposed in a hopper of a feeder for feeding electronic chip components. The at least one partition wall reduces the potential for damage to the components due to the reciprocating movement of a movable pipe disposed on the bottom of the hopper for agitating the electronic chip components. The reduced potential of degradation allows more electronic chip components to be accommodated in the hopper.

摘要翻译： 至少一个分隔壁设置在用于馈送电子芯片部件的馈线的漏斗中。 至少一个分隔壁由于设置在料斗的底部的可动管的往复运动而减小了对部件的损坏的可能性，用于搅动电子部件。 降低的降解电位允许更多的电子芯片部件容纳在料斗中。

公开(公告)号：US06340088B1

公开(公告)日：2002-01-22

申请号：US09345730

申请日：1999-07-01

申请人： Akira Mouri ,  Kiyoyuki Nakagawa ,  Kenichi Fukuda

发明人： Akira Mouri ,  Kiyoyuki Nakagawa ,  Kenichi Fukuda

IPC分类号： B65D8500

CPC分类号： B65D75/566 ,  B65D75/5805 ,  B65D75/5816 ,  B65D75/5822 ,  B65D2575/565 ,  H05K13/0084

摘要： Electronic components can be reliably supplied from a storage container for electronic components, which is easy to manufacture and highly economical, to a mounting device. The storage container for electronic components includes a storage region, in which electronic components are stored, a discharge hole, a lead portion for leading the electronic components to the discharge hole, the end of the lead portion becoming the discharge hole, a discharge hole side lead portion, provided with a taper (guide angle) so that its width becomes narrower toward the discharge hole, and a storage region side lead portion, positioned between the storage region and the discharge hole side lead portion, and provided with a taper (guide angle) so that its width becomes narrower toward the discharge hole side lead portion. In addition, the taper (guide angle) of the storage region side lead portion may be larger than the taper (guide angle) of the discharge hole side lead portion.

摘要翻译： 电子部件能够从容易制造且高度经济的用于电子部件的存储容器可靠地供给到安装装置。 电子部件用存储容器包括存储有电子部件的存储区域，排出孔，将电子部件引导到排出孔的引导部，引导部的端部成为排出孔，排出孔侧 引导部分，其具有锥形（引导角），使得其宽度朝向排出孔变窄;以及存储区域侧引线部分，位于存储区域和排出孔侧引线部分之间，并且设置有锥形（引导件） 角度）使得其宽度朝向排出孔侧引线部分变窄。 此外，存储区域侧引线部分的锥度（引导角）可以大于排出孔侧引线部分的锥度（引导角）。

公开(公告)号：US06953384B2

公开(公告)日：2005-10-11

申请号：US09988675

申请日：2001-11-20

申请人： Kiyoyuki Nakagawa ,  Kenichi Fukuda

发明人： Kiyoyuki Nakagawa ,  Kenichi Fukuda

IPC分类号： B08B3/04 ,  B24B21/04 ,  B65G47/14 ,  H05K13/02 ,  B24B1/00

CPC分类号： H05K13/028 ,  B24B21/04

摘要： An electronic component chip feeder enabling to feed electronic component chips in which electrodes on the outer surfaces thereof can be cleanly maintained and the reliability of electrical connections is excellent even when miniaturizing thereof is promoted, and a method for manufacturing electronic devices by using electronic component chips being excellent in the reliability of electrical connections are provided. The electronic component chip feeder for feeding electronic component chips includes a cleaning device disposed in an intermediate portion of a supplying system for supplying plural electronic component chips in an aligned relationship for cleaning outer surfaces of the electronic component chips.

摘要翻译： 一种电子元件芯片馈电器，其能够馈送其外表面上的电极可以被清洁地保持的电子元件芯片，并且即使促进其小型化，电连接的可靠性也是优异的，以及通过使用电子元件芯片来制造电子器件的方法 提供了电连接的可靠性优异。 用于馈送电子元件芯片的电子元件芯片馈送器包括设置在用于以清洁电子元件芯片的外表面的排列关系提供多个电子元件芯片的供电系统的中间部分中的清洁装置。

公开(公告)号：US06336843B2

公开(公告)日：2002-01-08

申请号：US09401526

申请日：1999-09-22

申请人： Kiyoyuki Nakagawa ,  Kenichi Fukuda

发明人： Kiyoyuki Nakagawa ,  Kenichi Fukuda

IPC分类号： B24B706

CPC分类号： H05K13/028 ,  B24B21/04

摘要： An electronic component chip feeder enabling to feed electronic component chips in which electrodes on the outer surfaces thereof can be cleanly maintained and the reliability of electrical connections is excellent even when miniaturizing thereof is promoted, and a method for manufacturing electronic devices by using electronic component chips being excellent in the reliability of electrical connections are provided. The electronic component chip feeder for feeding electronic component chips includes a cleaning device disposed in an intermediate portion of a supplying system for supplying plural electronic component chips in an aligned relationship for cleaning outer surfaces of the electronic component chips.

摘要翻译： 一种电子元件芯片馈电器，其能够馈送其外表面上的电极可以被清洁地保持的电子元件芯片，并且即使促进其小型化，电连接的可靠性也是优异的，以及通过使用电子元件芯片来制造电子器件的方法 提供了电连接的可靠性优异。 用于馈送电子元件芯片的电子元件芯片馈送器包括设置在用于以清洁电子元件芯片的外表面的排列关系提供多个电子元件芯片的供电系统的中间部分中的清洁装置。