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公开(公告)号：US20120085333A1
公开(公告)日：2012-04-12
申请号：US13272161
申请日：2011-10-12
申请人： Ki-Soo Kwon , Heui-Don Cho , Dong-Ouk Ji
发明人： Ki-Soo Kwon , Heui-Don Cho , Dong-Ouk Ji
CPC分类号： B28D5/045
摘要： Provided are an apparatus and a method for sawing a single crystal ingot. The apparatus includes a wire saw sawing an ingot, a roller driving the wire saw, and a bath containing a liquid cooling the ingot before sawing the ingot.
摘要翻译： 提供了用于锯切单晶锭的装置和方法。 该装置包括锯锯锯锭，驱动线锯的滚筒以及在切割锭之前含有冷却锭的液体的浴。
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公开(公告)号：US08414360B2
公开(公告)日：2013-04-09
申请号：US12700362
申请日：2010-02-04
申请人： Chi-Bok Lee , Heui-Don Cho
发明人： Chi-Bok Lee , Heui-Don Cho
摘要： A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers.
摘要翻译： 双面抛光装置包括用于抛光晶片两侧的上抛光板和下抛光板; 多个载体，每个载体包括中心板和周向板，所述中心板具有安装所述晶片的安装孔，所述圆周板具有装配所述中心板的嵌合孔和沿着所述外周形成的齿轮部分 安装孔的中心偏离中心板的中心，装配孔的中心偏离圆周板的中心; 以及太阳齿轮和内齿轮，与所述齿轮部分接合以向所述多个载体传递旋转力，其中，所述多个载体中的至少两个载体的中心板的装配方向可调整到装配孔中。
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公开(公告)号：US20110045748A1
公开(公告)日：2011-02-24
申请号：US12700362
申请日：2010-02-04
申请人： Chi-Bok Lee , Heui-Don Cho
发明人： Chi-Bok Lee , Heui-Don Cho
摘要： A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers.
摘要翻译： 双面抛光装置包括用于抛光晶片两侧的上抛光板和下抛光板; 多个载体，每个载体包括中心板和周向板，所述中心板具有安装所述晶片的安装孔，所述圆周板具有装配所述中心板的嵌合孔和沿着所述外周形成的齿轮部分 安装孔的中心偏离中心板的中心，装配孔的中心偏离圆周板的中心; 以及太阳齿轮和内齿轮，与所述齿轮部分接合以向所述多个载体传递旋转力，其中，所述多个载体中的至少两个载体的中心板的装配方向可调整到装配孔中。
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