公开(公告)号：US08624251B2

公开(公告)日：2014-01-07

申请号：US13430742

申请日：2012-03-27

申请人： Kentaro Agata ,  Syou Yanagisawa ,  Megumi Oomori

发明人： Kentaro Agata ,  Syou Yanagisawa ,  Megumi Oomori

IPC分类号： H01L31/00 ,  H01L29/04

CPC分类号： G06F3/0412 ,  G02F1/13452 ,  H01L27/124

摘要： An electronic panel includes insulation films that cover metal wirings and have plated through holes which expose parts of the respective metal wirings, oxide semiconductor films that electrically conducted with the metal wirings via the plated through holes formed on the insulation films, and an electrical component that includes electrodes which are electrically connected to the oxide semiconductor films. The oxide semiconductor film includes first and second portions in which the widths thereof are different from each other. The width of the first portion is wider than the width of the second portion. A portion faces a part of the metal wiring which is exposed from the plated through hole, and the portion is electrically connected to the part of the metal wiring. At least a part of the second portion faces the electrode of the electrical component and is electrically connected to the electrode.

摘要翻译： 电子面板包括覆盖金属布线的绝缘膜，并且具有暴露各个金属布线部分的电镀通孔，通过形成在绝缘膜上的电镀通孔与金属布线电连接的氧化物半导体膜以及电气部件， 包括电连接到氧化物半导体膜的电极。 氧化物半导体膜包括其宽度彼此不同的第一和第二部分。 第一部分的宽度比第二部分的宽度宽。 一部分面对从电镀通孔露出的金属配线的一部分，该部分与金属配线的一部分电连接。 第二部分的至少一部分面向电气部件的电极并且电连接到电极。