Bonding wire impedance matching circuit
    1.
    发明授权
    Bonding wire impedance matching circuit 有权
    接线阻抗匹配电路

    公开(公告)号:US09118301B2

    公开(公告)日:2015-08-25

    申请号:US13716406

    申请日:2012-12-17

    CPC classification number: H03H7/38 H01P5/028

    Abstract: An impedance matching circuit is provided. The present impedance matching circuit is able to match impedance using a transformer which is arranged inside a dielectric substrate and arranged to overlap with a bonding pad area and an end of a transmission line, thereby enabling transmitting signals at a desired frequency with a minimum insertion loss without using a very thin transmission line which is several to dozens of μm wide or specially designed antennas in order to compensate for inductance. Thus, the present impedance matching circuit may be applied to various millimeter bands.

    Abstract translation: 提供阻抗匹配电路。 本阻抗匹配电路能够使用布置在电介质基板内部并且布置成与接合焊盘区域和传输线的端部重叠的变压器来匹配阻抗,从而能够以期望的频率以最小的插入损耗发送信号 而不使用几十微米宽或特别设计的天线的非常薄的传输线,以补偿电感。 因此,本阻抗匹配电路可以应用于各种毫米波段。

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