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公开(公告)号：US20230221386A1
公开(公告)日：2023-07-13
申请号：US18149232
申请日：2023-01-03
Inventor： Kab-Jin Kim , Jun-Ho KANG
CPC classification number: G01R33/07 , G01R33/0206
Abstract: A magnetic sensor includes a silicon substrate, a cross-shaped metal pattern formed on the silicon substrate and directly contacting the silicon substrate, and an insulating layer covering the cross-shaped metal pattern.
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