公开(公告)号：US12122941B2

公开(公告)日：2024-10-22

申请号：US17561373

申请日：2021-12-23

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Steve Park ,  Hyeonji Kim ,  Gun-Hee Lee ,  Jae-Woong Jeong

IPC: H01B1/22 ,  C09D5/24 ,  C09D7/20 ,  C09D7/62 ,  C09D181/08 ,  H01B5/14 ,  C08K9/04

CPC classification number: C09D5/24 ,  C09D7/20 ,  C09D7/62 ,  C09D181/08 ,  H01B1/22 ,  H01B5/14 ,  C08K9/04

Abstract: The present disclosure provides a liquid metal precursor solution, including: metal precursor particles including metal particles and a polymer film surrounding the metal particles; and a solvent mixed with the metal precursor particles, wherein each of the polymer film and the solvent includes a functional group having electrostatic repulsion force to each other so that the metal precursor particles may be dispersed in the solvent.

公开(公告)号：US20220315773A1

公开(公告)日：2022-10-06

申请号：US17561373

申请日：2021-12-23

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Steve Park ,  Hyeonji Kim ,  Gun-Hee Lee ,  Jae-Woong Jeong

IPC: C09D5/24 ,  C09D7/62 ,  C09D7/20 ,  C09D181/08 ,  H01B5/14 ,  H01B1/22

Abstract: The present disclosure provides a liquid metal precursor solution, including: metal precursor particles including metal particles and a polymer film surrounding the metal particles; and a solvent mixed with the metal precursor particles, wherein each of the polymer film and the solvent includes a functional group having electrostatic repulsion force to each other so that the metal precursor particles may be dispersed in the solvent.