公开(公告)号：US20220229233A1

公开(公告)日：2022-07-21

申请号：US17576212

申请日：2022-01-14

Applicant: Korea Advanced Institute of Science and Technology ,  Gwangju Institute of Science and Technology

Inventor： Hyo-Hoon Park ,  Jong-Bum You ,  Dong-Eun Yoo ,  Ju-Beom Lee ,  In Ki Kim ,  Tae Joon Seok ,  Geumbong Kang ,  Hyeonho Yoon ,  Nam-Hyun Kwon

IPC: G02B6/12 ,  G02B6/136 ,  B81B3/00

Abstract: Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.

公开(公告)号：US11640030B2

公开(公告)日：2023-05-02

申请号：US17576212

申请日：2022-01-14

Applicant: Korea Advanced Institute of Science and Technology ,  Gwangju Institute of Science and Technology

Inventor： Hyo-Hoon Park ,  Jong-Bum You ,  Dong-Eun Yoo ,  Ju-Beom Lee ,  In Ki Kim ,  Tae Joon Seok ,  Geumbong Kang ,  Hyeonho Yoon ,  Nam-Hyun Kwon

IPC: G02B6/12 ,  G02B6/136 ,  B81B3/00

Abstract: Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.

公开(公告)号：US11609330B2

公开(公告)日：2023-03-21

申请号：US16839277

申请日：2020-04-03

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Hyo-Hoon Park ,  Hyeonho Yoon ,  Nam-Hyun Kwon ,  Kyeongjin Han ,  Hyun-Woo Rhee ,  Geum-Bong Kang

IPC: G01S7/481 ,  G01S17/32 ,  G01S7/4913

Abstract: A silicon phased array based LiDAR device that measures a distance using a quasi-frequency modulation is disclosed. A LiDAR device according to an exemplary embodiment of the inventive concept includes a light source that generates an optical signal, an optical modulator that generates a first optical signal having a quasi-frequency whose a modulation frequency constantly varies with time by modulating a light intensity of the optical signal, an optical splitter that splits optical power of the first optical signal into a reference optical signal and a transmit (Tx) optical signal, an optical transmitter that receives and emits the Tx optical signal toward an object, an optical receiver that receives a receive (Rx) optical signal reflected from the object and transfers the Rx optical signal, an optical coupler that mixes the reference optical signal and the Rx optical signal, a balanced photodetector that detects an intermediate frequency from the optical signal transferred from the optical coupler and a distance calculator that obtains distance information by measuring the intermediate frequency.