公开(公告)号：US11562837B2

公开(公告)日：2023-01-24

申请号：US17387349

申请日：2021-07-28

Applicant: KOA CORPORATION

Inventor： Satoshi Kanegae

IPC: H01C7/00 ,  H01C1/14 ,  H01C1/01

Abstract: Particularly, it is an object to provide a circuit substrate that can reduce a field intensity near an electrode having a high potential. A circuit substrate of the present invention includes an insulated substrate, a thin-film resistive element, and electrodes electrically connected to both sides of the thin-film resistive element, the thin-film resistive element and the electrodes being disposed on a surface of the insulated substrate. The circuit substrate is characterized in that the thin-film resistive element has a pattern in which a resistance wire is repeatedly folded back, and a dummy wire for reducing a field intensity is provided on a high-potential electrode side.

公开(公告)号：US20190198203A1

公开(公告)日：2019-06-27

申请号：US16311858

申请日：2017-06-02

Applicant: KOA CORPORATION

Inventor： Satoshi Kanegae ,  Tomonori Oguchi ,  Noboru Kashiwagi

IPC: H01C13/02 ,  H01C17/00 ,  H01C1/034 ,  H01C1/01 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01C13/02 ,  H01C1/01 ,  H01C1/034 ,  H01C17/006 ,  H01L23/29 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/50 ,  H01L2224/06 ,  H01L2224/48247 ,  H01L2224/49171

Abstract: Provided is a surface-mountable thin film resistor network, which includes a chip, on which a thin film resistor network integrated array is formed, and a molded resin package, which encapsulate the chip. The surface-mountable thin film resistor network is provided with a chip (13) on which a thin film resistor integrated array has been formed; an island (12) on which the chip is fixed; a plurality of lead terminals (14) extending outward around periphery of the island; wires (15) connecting electrodes of resistors mounted on the chip to the lead terminals; and a molded resin package (20) that encapsulate a portion, which includes the wires; wherein a hanging lead (18) extending from the island is cut at an end surface of the molded resin package, and an electrical insulation (21) is applied to the cut section of the hanging lead.