公开(公告)号：US20240210119A1

公开(公告)日：2024-06-27

申请号：US18597845

申请日：2024-03-06

申请人： KMW INC.

发明人： Kang Hyun LEE ,  Hyung Seok KIM ,  Hyung Gun IM

IPC分类号： F28D15/04 ,  C23C18/16 ,  C23C18/18 ,  C23C18/32 ,  C23C28/02 ,  C25D3/38 ,  F28D15/02 ,  F28D21/00

CPC分类号： F28D15/046 ,  C23C18/1637 ,  C23C18/1648 ,  C23C18/165 ,  C23C18/1844 ,  C23C18/32 ,  C23C28/023 ,  C25D3/38 ,  F28D15/0233 ,  F28D2021/0029

摘要： Disclosed herein are a vapor chamber and a method of producing the same. The vapor chamber includes a chamber body plate having one surface placed in close contact with a heating surface of a heating element and the other surface that is open, and having a refrigerant filling space filled with a refrigerant therein and defined to have a predetermined thickness, a chamber cover plate bonded to shield the other open surface of the chamber body plate, and a wick formed in the refrigerant filling space, which is a space between the chamber body plate and the chamber cover plate, and having at least multiple pores through which the refrigerant filled in the refrigerant filling space flows. The wick has the multiple pores formed through an electroless Ni plating process with aluminum powder filled in the refrigerant filling space, providing an advantage of simple manufacturing and excellent heat conduction performance.

公开(公告)号：US20240308006A1

公开(公告)日：2024-09-19

申请号：US18672027

申请日：2024-05-23

申请人： KMW INC.

发明人： Kang Hyun LEE ,  Hyung Seok KIM ,  Hang Hyeon CHO ,  Jong Min LEE ,  Jae Ho JANG

IPC分类号： B23P15/26 ,  B23K26/21 ,  F28D15/04

CPC分类号： B23P15/26 ,  B23K26/21 ,  F28D15/04 ,  B23P2700/09

摘要： According to at least one aspect, the present disclosure provides A method for manufacturing a heating element cooling structure, the method comprising: manufacturing an upper plate, which includes a plurality of column units, by using a press mold method; manufacturing a lower plate by using the press mold method; forming a wick unit at one or more of an inner surface of the upper plate and an inner surface of the lower plate by using a laser; and bonding the upper plate and the lower plate to each other.