公开(公告)号：US20180150952A1

公开(公告)日：2018-05-31

申请号：US15627834

申请日：2017-06-20

Applicant: KLA-Tencor Corporation

Inventor： Kaushik Sah ,  Thomas Krah ,  Shifang Li ,  Heiko Eisenbach ,  Moritz Stoerring

IPC: G06T7/00 ,  G06T7/13 ,  G06T7/60 ,  G01B11/24 ,  G01B11/00

Abstract: Wafer edge profile images are analyzed at locations around a bonded wafer, which may have a top wafer and a carrier wafer. An offset curve is generated based on the wafer edge profile images. Displacement of the top wafer to the carrier wafer is determined based on the offset curve. The wafer edge profile images may be generated at multiple locations around the wafer. The wafer edge profile images may be shadowgram images. A system to determine displacement of the top wafer to the carrier wafer can include an imaging system connected with a controller.

公开(公告)号：US10540759B2

公开(公告)日：2020-01-21

申请号：US15627834

申请日：2017-06-20

Applicant: KLA-Tencor Corporation

Inventor： Kaushik Sah ,  Thomas Krah ,  Shifang Li ,  Heiko Eisenbach ,  Moritz Stoerring

IPC: G06K9/00 ,  G06T7/00 ,  G06T7/73 ,  H01L21/66 ,  G06T7/13 ,  G01B11/00 ,  G01B11/24 ,  G06T7/60 ,  H01L21/306

Abstract: Wafer edge profile images are analyzed at locations around a bonded wafer, which may have a top wafer and a carrier wafer. An offset curve is generated based on the wafer edge profile images. Displacement of the top wafer to the carrier wafer is determined based on the offset curve. The wafer edge profile images may be generated at multiple locations around the wafer. The wafer edge profile images may be shadowgram images. A system to determine displacement of the top wafer to the carrier wafer can include an imaging system connected with a controller.