Abstract:
Substrate support apparatus and methods are disclosed. Motion of a substrate chuck relative to a stage mirror may be dynamically compensated by sensing a displacement of the substrate chuck relative to the stage mirror and coupling a signal proportional to the displacement in one or more feedback loops with Z stage actuators and/or XY stage actuators coupled to the stage mirror. Alternatively, a substrate support apparatus may include a Z stage plate a stage mirror, one or more actuators attached to the Z stage plate, and a substrate chuck mounted to the stage mirror with constraints on six degrees of freedom of movement of the substrate chuck. The actuators impart movement to the Z stage in a Z direction as the Z stage plate is scanned in a plane perpendicular to the Z direction. The actuators may include force flexures having a base portion attached to the Z stage plate and a cantilever portion extending in a lateral direction from the base portion. The cantilever portion may include a parallelogram flexure coupled between the base portion and a free end of the cantilever portion.
Abstract:
Systems and methods to precisely balance the amount of heat removed from a specimen with the amount of heat generated during processing are presented. In some embodiments, the heat introduced into the specimen is rapidly removed by a temperature controlled cooling element via radiative heat transfer. In some embodiments, a heating element is disposed between the specimen and the cooling element. The heating element is controlled to precisely balance the amount of heat removed from the specimen with the amount of heat generated. A control signal is generated based on the amount of process energy known apriori. The control signal may also be based on an indication of a temperature of the specimen. In some embodiments, an adjustable aperture is employed to change the surface area of the cooling element exposed to the specimen, and thus control the amount of heat absorbed from the specimen by the cooling element.