公开(公告)号：US10444639B2

公开(公告)日：2019-10-15

申请号：US15843371

申请日：2017-12-15

Applicant: KLA-Tencor Corporation

Inventor： Onur Nihat Demirer ,  William Pierson ,  Mark D. Smith ,  Jeremy S. Nabeth ,  Miguel Garcia-Medina ,  Lipkong Yap

IPC: G03F7/20 ,  H01L21/027 ,  G03F9/00

Abstract: A process control system includes a controller configured to generate a reference overlay signature based on one or more overlay reference layers of a sample, extrapolate the reference overlay signature to a set of correctable fields for the exposure of a current layer of the sample to generate a full-field reference overlay signature, identify one or more alignment fields of the set of correctable fields, generate an alignment-correctable signature by modeling alignment corrections for the set of correctable fields, subtract the alignment-correctable signature from the full-field reference overlay signature to generate feedforward overlay corrections for the current layer when the one or more overlay reference layers are the same as the one or more alignment reference layers, generate lithography tool corrections based on the feedforward overlay corrections, and provide the lithography tool corrections for the current layer to the lithography tool.

公开(公告)号：US20180253016A1

公开(公告)日：2018-09-06

申请号：US15843371

申请日：2017-12-15

Applicant: KLA-Tencor Corporation

Inventor： Onur Nihat Demirer ,  William Pierson ,  Mark D. Smith ,  Jeremy S. Nabeth ,  Miguel Garcia-Medina ,  Lipkong Yap

IPC: G03F7/20 ,  H01L21/027

CPC classification number: G03F7/70633 ,  G03F7/70258 ,  G03F7/705 ,  G03F9/7046 ,  H01L21/0274

Abstract: A process control system includes a controller configured to generate a reference overlay signature based on one or more overlay reference layers of a sample, extrapolate the reference overlay signature to a set of correctable fields for the exposure of a current layer of the sample to generate a full-field reference overlay signature, identify one or more alignment fields of the set of correctable fields, generate an alignment-correctable signature by modeling alignment corrections for the set of correctable fields, subtract the alignment-correctable signature from the full-field reference overlay signature to generate feedforward overlay corrections for the current layer when the one or more overlay reference layers are the same as the one or more alignment reference layers, generate lithography tool corrections based on the feedforward overlay corrections, and provide the lithography tool corrections for the current layer to the lithography tool.