公开(公告)号：US10303153B2

公开(公告)日：2019-05-28

申请号：US15129521

申请日：2016-08-04

Applicant: KLA-Tencor Corporation

Inventor： Slawomir Czerkas ,  Frank Laske

IPC: G05B19/40 ,  G05B19/402 ,  G03F9/00

Abstract: In a method for controlling the positioning of patterns on a substrate in a manufacturing process at least one registration measurement is conducted with a registration tool on at least one pattern formed in at least one layer on the substrate by a previous process step of the manufacturing process. From the registration measurement a position of the at least one pattern in a coordinate system is determined. The determined position of the at least one pattern is fed into an automatic process control of a manufacturing system for controlling a setup of the manufacturing system for a subsequent process step of the manufacturing process. The manufacturing process may be a wafer manufacturing process with a silicon substrate. Complementary information may be collected in addition to performing the registration measurement and fed to the automatic process control. The process steps may for example include lithography steps, etching steps, layer deposition.

公开(公告)号：US20180120807A1

公开(公告)日：2018-05-03

申请号：US15129521

申请日：2016-08-04

Applicant: KLA-Tencor Corporation

Inventor： Slawomir Czerkas ,  Frank Laske

IPC: G05B19/402

CPC classification number: G05B19/402 ,  G03F9/7003 ,  G05B2219/45028 ,  G05B2219/45031

Abstract: In a method for controlling the positioning of patterns on a substrate in a manufacturing process at least one registration measurement is conducted with a registration tool on at least one pattern formed in at least one layer on the substrate by a previous process step of the manufacturing process. From the registration measurement a position of the at least one pattern in a coordinate system is determined. The determined position of the at least one pattern is fed into an automatic process control of a manufacturing system for controlling a setup of the manufacturing system for a subsequent process step of the manufacturing process. The manufacturing process may be a wafer manufacturing process with a silicon substrate. Complementary information may be collected in addition to performing the registration measurement and fed to the automatic process control. The process steps may for example include lithography steps, etching steps, layer deposition.

公开(公告)号：US09424636B2

公开(公告)日：2016-08-23

申请号：US14643610

申请日：2015-03-10

Applicant: KLA-TENCOR CORPORATION

Inventor： Frank Laske ,  Mohammad M. Daneshpanah ,  Slawomir Czerkas ,  Mark Wagner

IPC: G06K9/00 ,  G06T7/00 ,  G03F1/84

CPC classification number: G06T7/001 ,  G03F1/84 ,  G06T2207/30148

Abstract: The invention discloses a method for measuring positions of structures on a mask and thereby determining mask manufacturing errors. It is shown, that from a plurality measurement sites an influence of an optical proximity effect on a position measurement of structures on the mask, is determined with a metrology tool. A rendered image of the data representation of the structures is obtained. Additionally, at least one optical image of the pattern within the area on the mask is captured with the imaging system of the metrology tool. The field of view of the metrology tool is approximately identical to the size of the selected area of the mask design data. Finally, a residual is determined, which shows the manufacturing based proximity effect.

Abstract translation: 本发明公开了一种用于测量掩模上结构位置的方法，从而确定掩模制造误差。 示出了从多个测量位置，使用计量工具确定光学邻近效应对掩模上的结构的位置测量的影响。 获得结构的数据表示的渲染图像。 另外，用计量工具的成像系统捕获掩模区域内的图案的至少一个光学图像。 计量工具的视野与掩模设计数据的选定区域的大小大致相同。 最后，确定残差，显示了基于制造的邻近效应。