公开(公告)号：US10381256B2

公开(公告)日：2019-08-13

申请号：US15065430

申请日：2016-03-09

Applicant: KLA-TENCOR CORPORATION

Inventor： Pradeep Subrahmanyan ,  Luping Huang ,  Chris Pohlhammer

IPC: H01L21/683 ,  H01L21/67

Abstract: An apparatus for fixing a wafer, including a chuck having a surface, a plurality of through bores in the chuck extending through the surface of the chuck, a fixed vacuum bellows, and a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores and elevationally above the surface of the chuck.