Correcting target locations for temperature in semiconductor applications

    公开(公告)号:US12148639B2

    公开(公告)日:2024-11-19

    申请号:US17959008

    申请日:2022-10-03

    Abstract: Methods and systems for determining information for a specimen are provided. One system includes an output acquisition subsystem configured to generate output for a specimen at one or more target locations on the specimen and one or more temperature sensors configured to measure one or more temperatures within the system. The system also includes a deep learning model configured for predicting error in at least one of the one or more target locations based on at least one of the one or more measured temperatures input to the deep learning model by the computer subsystem. The computer subsystem is configured for determining a corrected target location for the at least one of the one or more target locations by applying the predicted error to the at least one of the one or more target locations.

    CORRECTING TARGET LOCATIONS FOR TEMPERATURE IN SEMICONDUCTOR APPLICATIONS

    公开(公告)号:US20240120221A1

    公开(公告)日:2024-04-11

    申请号:US17959008

    申请日:2022-10-03

    CPC classification number: H01L21/67248 H01L22/12

    Abstract: Methods and systems for determining information for a specimen are provided. One system includes an output acquisition subsystem configured to generate output for a specimen at one or more target locations on the specimen and one or more temperature sensors configured to measure one or more temperatures within the system. The system also includes a deep learning model configured for predicting error in at least one of the one or more target locations based on at least one of the one or more measured temperatures input to the deep learning model by the computer subsystem. The computer subsystem is configured for determining a corrected target location for the at least one of the one or more target locations by applying the predicted error to the at least one of the one or more target locations.

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