公开(公告)号：US11726410B2

公开(公告)日：2023-08-15

申请号：US17351137

申请日：2021-06-17

Applicant: KLA Corporation

Inventor： Eitan Hajaj ,  Amnon Manassen ,  Shlomo Eisenbach ,  Anna Golotsvan ,  Yoav Grauer ,  Eugene Maslovsky

IPC: G03F7/20 ,  G03F7/00 ,  H01L21/66

CPC classification number: G03F7/70633 ,  G03F7/70683 ,  H01L22/12

Abstract: A product includes at least one semiconductor substrate, multiple thin-film layers disposed on the at least one substrate, and an overlay target formed in at least one of the thin-film layers. The overlay target includes a first sub-target having a first center of symmetry and including first target features having a first linewidth, and a second sub-target having a second center of symmetry coincident with the first center of symmetry and including second target features, which have a second linewidth, greater than the first linewidth, and are adjacent to but non-overlapping with the first target features.

公开(公告)号：US20220334501A1

公开(公告)日：2022-10-20

申请号：US17351137

申请日：2021-06-17

Applicant: KLA Corporation

Inventor： Eitan Hajaj ,  Amnon Manassen ,  Shlomo Eisenbach ,  Anna Golotsvan ,  Yoav Grauer ,  Eugene Maslovsky

IPC: G03F7/20 ,  H01L21/66

Abstract: A product includes at least one semiconductor substrate, multiple thin-film layers disposed on the at least one substrate, and an overlay target formed in at least one of the thin-film layers. The overlay target includes a first sub-target having a first center of symmetry and including first target features having a first linewidth, and a second sub-target having a second center of symmetry coincident with the first center of symmetry and including second target features, which have a second linewidth, greater than the first linewidth, and are adjacent to but non-overlapping with the first target features.