公开(公告)号：US20200002573A1

公开(公告)日：2020-01-02

申请号：US16426906

申请日：2019-05-30

Applicant: KCTECH CO., LTD.

Inventor： Hyungoo Kong ,  Jinsook Hwang ,  Sangmi Lee ,  Inseol Hwang ,  Nara Shin

IPC: C09G1/02

Abstract: Provided is a polishing slurry composition including colloidal silica abrasive particles, a metal oxide monomolecular complexing agent, an oxidizer, and a pH adjusting agent, a water-soluble polymer, or both.

公开(公告)号：US11279851B2

公开(公告)日：2022-03-22

申请号：US16426906

申请日：2019-05-30

Applicant: KCTECH CO., LTD.

Inventor： Hyungoo Kong ,  Jinsook Hwang ,  Sangmi Lee ,  Inseol Hwang ,  Nara Shin

IPC: C09G1/02 ,  H01L21/321

Abstract: Provided is a polishing slurry composition including colloidal silica abrasive particles, a metal oxide monomolecular complexing agent, an oxidizer, and a pH adjusting agent, a water-soluble polymer, or both.