-
公开(公告)号：US11332641B2
公开(公告)日：2022-05-17
申请号：US17123115
申请日：2020-12-16
Applicant: KCTECH CO., LTD.
Inventor： Gi Joo Shin , Jung Yoon Kim , Kwang Soo Park , Soo Wan Choi
IPC: C09G1/02 , C09K3/14 , H01L21/3105
Abstract: A polishing slurry composition enabling implementation of multi-selectivity is provided. The polishing slurry composition includes: a polishing liquid including abrasive particles; and an additive liquid, in which the additive liquid includes a polymer having an amide bond, and a cationic polymer.
Search Results
1
records
(took 0.01 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
