公开(公告)号：US20230303790A1

公开(公告)日：2023-09-28

申请号：US18252618

申请日：2021-10-04

申请人： KABUSHIKI KAISHA RIKEN

发明人： Takeshi MAKABE ,  Taichi AKAOKA

IPC分类号： B29C71/02 ,  C08J5/00 ,  B32B3/30 ,  B32B27/28 ,  B32B27/08 ,  B32B27/16 ,  B29C35/08 ,  B29C71/00

CPC分类号： C08J7/08 ,  C08J5/00 ,  B32B3/30 ,  B32B27/285 ,  B32B27/08 ,  B32B27/16 ,  B29C35/0866 ,  B29C71/0063 ,  C08J2361/16 ,  B32B2307/554 ,  B32B2307/536 ,  B32B2307/54 ,  B32B2307/5825 ,  B29K2071/00

摘要： [Object] To provide a technology capable of further improvement of the performance of a PEEK molded body.
[Solving Means] A PEEK molded body includes: a body portion having a first exothermic peak, and a second exothermic peak positioned at a higher temperature than the first exothermic peak, as two exothermic peaks indicating crystallization of PEEK in a DSC curve. The surface layer portion covers the body portion, and has a third exothermic peak, positioned at a higher temperature than the first exothermic peak, as an only exothermic peak indicating crystallization of PEEK in a DSC curve.
[Selected Drawing] None