公开(公告)号：US20170353402A1

公开(公告)日：2017-12-07

申请号：US15170608

申请日：2016-06-01

Applicant: Juniper Networks, Inc.

Inventor： John KENNEY ,  Christopher OTTE ,  Bhavesh PATEL ,  Valery KUGEL ,  Muhammad SAGARWALA

IPC: H04L12/931 ,  H04L12/935

CPC classification number: H04L49/40 ,  H04L47/125 ,  H04L49/205 ,  H04L49/3009 ,  H04L49/45

Abstract: A system may receive, by a switching component of the system, network traffic to be provided to an I/O component of the network device. The system may route, by the switching component, the network traffic to the I/O component based on whether the I/O component is connected to the switching component via the first connections and/or via second connections. The first connections may be connections via a chassis of the system. The second connections may be connections via a connector component that is removable from the switching component. The network traffic may be routed via the first connections and the second connections when the I/O component is connected via the first connections and the second connections. The network traffic may be routed via the first connections and not via the second connections when the I/O component is connected via the first connections and not via the second connections.

公开(公告)号：US20240186266A1

公开(公告)日：2024-06-06

申请号：US18165787

申请日：2023-02-07

Applicant: Juniper Networks, Inc.

Inventor： Valery KUGEL ,  Omar AHMED ,  Peng SU

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/49816

Abstract: A semiconductor package includes a substrate, a semiconductor device, and a stiffener. The substrate has a top surface and a bottom surface. The semiconductor device is disposed on the top surface of the substrate. The stiffener is disposed on the bottom surface of the substrate. The stiffener may be disposed on a perimeter portion of the bottom surface of the substrate, and may not be disposed on a central portion of the bottom surface of the substrate. One or more connection components may disposed on the central portion of the bottom surface of the substrate, and a thickness of the stiffener may be greater than or equal to a thickness of the one or more connection components.

公开(公告)号：US20240266301A1

公开(公告)日：2024-08-08

申请号：US18165790

申请日：2023-02-07

Applicant: Juniper Networks, Inc.

Inventor： Gautam GANGULY ,  Valery KUGEL ,  Omar AHMED ,  Leif HUTCHINSON ,  Peng SU ,  Matthew TWAROG ,  Attila I. ARANYOSI ,  David K. OWEN ,  Chang-Hong WU ,  Aliaskar HASSANZADEH ,  Boris REYNOV ,  Muhammad SAGARWALA

IPC: H01L23/00 ,  H01L23/498 ,  H05K1/18

CPC classification number: H01L23/562 ,  H01L23/49833 ,  H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: An apparatus, includes a PCB, a semiconductor package that includes a substrate and a stiffener with an opening, and at least one connection component. The stiffener is disposed on a top surface of the PCB. The at least one connection component is configured to connect the PCB to the semiconductor package. The at least one connection component may include another PCB that is disposed on the substrate within the opening of the stiffener and on the PCB. The at least one connection component may include an array of connectors that are disposed on the substrate within the opening of the stiffener, and may include a socket disposed on the PCB. The at least one connection component may include a BGA that is disposed on the substrate within the opening of the stiffener and on the PCB and on a pedestal portion of a surface of the PCB.