公开(公告)号：US10591964B1

公开(公告)日：2020-03-17

申请号：US15432195

申请日：2017-02-14

Applicant: Juniper Networks, Inc.

Inventor： Travis S. Mikjaniec ,  Mahesh Nagarajan ,  Henry K. Sim ,  Daniel Farmer ,  Attila I. Aranyosi

IPC: G06F1/20 ,  H05K7/20

Abstract: The disclosed apparatus may include (1) a plurality of vapor chambers that (A) are mounted to a plurality of individual power components that dissipate heat within a computing device and (B) absorb heat dissipated by the plurality of individual power components within the computing device and (2) at least one thermal coupling that (A) physically bridges the plurality of vapor chambers to one another within the computing device and (B) facilitates heat transfer among the plurality of vapor chambers mounted to the individual power components. Various other apparatuses, systems, and methods are also disclosed.