公开(公告)号：US12288741B2

公开(公告)日：2025-04-29

申请号：US18297150

申请日：2023-04-07

Applicant: Juniper Networks, Inc.

Inventor： Granthana Kattehalli Rangaswamy ,  Arvind Hanumantharayappa ,  Srinivas Venkataraman

IPC: H01L23/498 ,  H01L23/00 ,  H05K1/11 ,  H05K3/34

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

公开(公告)号：US20210057319A1

公开(公告)日：2021-02-25

申请号：US17089414

申请日：2020-11-04

Applicant: Juniper Networks, Inc.

Inventor： Granthana Kattehalli Rangaswamy ,  Arvind Hanumantharayappa ,  Srinivas Venkataraman

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/00

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

公开(公告)号：US20230245964A1

公开(公告)日：2023-08-03

申请号：US18297150

申请日：2023-04-07

Applicant: Juniper Networks, Inc.

Inventor： Granthana Kattehalli Rangaswamy ,  Arvind Hanumantharayappa ,  Srinivas Venkataraman

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H05K1/113 ,  H05K3/3436 ,  H01L24/11 ,  H01L24/73 ,  H01L24/03 ,  H01L24/09 ,  H01L2924/15311 ,  H05K2201/10734 ,  H01L24/17

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

公开(公告)号：US11652035B2

公开(公告)日：2023-05-16

申请号：US17089414

申请日：2020-11-04

Applicant: Juniper Networks, Inc.

Inventor： Granthana Kattehalli Rangaswamy ,  Arvind Hanumantharayappa ,  Srinivas Venkataraman

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L24/03 ,  H01L24/11 ,  H01L24/73 ,  H05K1/113 ,  H05K3/3436 ,  H01L24/09 ,  H01L24/17 ,  H01L2924/15311 ,  H05K2201/10734

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.