公开(公告)号：US20230213909A1

公开(公告)日：2023-07-06

申请号：US18096965

申请日：2023-01-13

Applicant: Johnson Controls Tyco IP Holdings LLP

Inventor： Miguel Galvez ,  Richard J. Campero ,  Eric G. Lang ,  Abu Bakr Khan ,  Donald A. Gottschalk, JR. ,  Daniel M. Curtis ,  Trent M. Swanson ,  Karl F. Reichenberger

IPC: G05B19/042

CPC classification number: G05B19/042 ,  G05B2219/25011

Abstract: A method can include activating a building platform chip integrated into a building device of a building and coupled with a processing circuit of the building device. The method can include retrieving, by the building platform chip, first data from the processing circuit of the building device through communication with the processing circuit. The method can include generating, by the building platform chip, second data to cause a digital twin of the building device to be constructed.