Card and card manufacturing method
    1.
    发明授权
    Card and card manufacturing method 有权
    卡和卡制造方法

    公开(公告)号:US09104949B2

    公开(公告)日:2015-08-11

    申请号:US14240464

    申请日:2012-08-23

    摘要: Provided are a card and card manufacturing method that enable clear visual recognition of a display in a display portion even if the card surface has been provided with a matte finish, and enable an improvement in texture related to position drift between a display device and a window portion, as well as an improvement in workability during manufacture. The card (1) has: a display portion (10); an electronic component that controls a display to the display portion (10); a surface layer (20) placed as the topmost layer of the card (1) and formed from a clear material; a mirror-surface portion (21) provided on a portion that overlaps the display portion (10); and a matte portion (22) provided on a portion outside the mirror-surface portion (21), said matte portion (22) having a coarser grain than the mirror-surface portion (21).

    摘要翻译: 提供一种卡和卡制造方法,即使卡表面具有无光泽的表面,也能够使显示部分中的显示器清晰地视觉识别,并且能够改善与显示装置和窗口之间的位置偏移相关的纹理 部分,以及在制造过程中的可操作性的改善。 卡(1)具有:显示部(10); 控制对显示部分(10)的显示的电子部件; 作为卡(1)的最上层放置并由透明材料形成的表面层(20); 设置在与显示部分重叠的部分上的镜面部分(21); 和设置在镜面部分(21)外部的部分上的磨砂部分(22),所述磨砂部分(22)具有比镜面部分(21)更粗的颗粒。

    CARD WITH BUILT-IN ELECTRONIC COMPONENT
    2.
    发明申请
    CARD WITH BUILT-IN ELECTRONIC COMPONENT 有权
    卡内置电子元件

    公开(公告)号:US20140016286A1

    公开(公告)日:2014-01-16

    申请号:US13991843

    申请日:2011-12-05

    申请人: Jintaro Tatsu

    发明人: Jintaro Tatsu

    IPC分类号: G06K19/077

    摘要: Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.

    摘要翻译: 提供了具有内置电子部件的卡,具有优异的按钮感觉。 本发明的卡内置有配置有电子部件的模块基板,具有:堆叠在模块基板上方的前盖片; 附着在模块基板和前盖板之间的粘合层; 以及设置在模块基板上的圆顶开关,并且通过按压卡的上表面,开关的可动部分变形到模块基板侧,使得电接触与模块基板触觉接触以便操作 卡片; 其中开关的可移动部分使得上表面不粘附到粘合层,并且相对于粘合层而言,对模块基板侧的变形是不受约束的。

    Card with built-in electronic component
    3.
    发明授权
    Card with built-in electronic component 有权
    内置电子元件卡

    公开(公告)号:US09384436B2

    公开(公告)日:2016-07-05

    申请号:US13991843

    申请日:2011-12-05

    申请人: Jintaro Tatsu

    发明人: Jintaro Tatsu

    摘要: Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.

    摘要翻译: 提供了具有内置电子部件的卡,具有优异的按钮感觉。 本发明的卡内置有配置有电子部件的模块基板,具有:堆叠在模块基板上方的前盖片; 附着在模块基板和前盖板之间的粘合层; 以及设置在模块基板上的圆顶开关,并且通过按压卡的上表面,开关的可动部分变形到模块基板侧,使得电接触与模块基板触觉接触以便操作 卡片; 其中开关的可移动部分使得上表面不粘附到粘合层,并且相对于粘合层而言,对模块基板侧的变形是不受约束的。