公开(公告)号：US20060251480A1

公开(公告)日：2006-11-09

申请号：US11381513

申请日：2006-05-03

Applicant: James Mann ,  Srinivasan Chandrasekar ,  Walter Compton

Inventor： James Mann ,  Srinivasan Chandrasekar ,  Walter Compton

IPC: B23B47/28

CPC classification number: B23B29/125 ,  B22F2998/00 ,  B23B25/02 ,  B23B27/045 ,  B23B37/00 ,  B23B47/34 ,  B23B2260/0625 ,  B23B2260/102 ,  B23B2260/108 ,  B23P17/06 ,  Y10S82/904 ,  Y10T82/10 ,  Y10T82/12 ,  Y10T408/03 ,  Y10T408/23 ,  B22F9/04 ,  B22F2202/01 ,  B22F1/0044 ,  B22F1/004 ,  B22F1/0055

Abstract: A tool holder assembly and method for intentionally inducing modulation in a machining process. The tool holder assembly is configured for mounting in a tool block on a machining apparatus and includes a tool holder body configured to be secured to the tool block of the machining apparatus, a tool holder mounted on the tool holder body and configured for securing a cutting tool thereto, and a device for imposing a superimposed modulation on the tool holder so as to move the cutting tool relative to the tool holder body and thereby relative to the tool. The tool holder assembly is useful in a process for producing chips having a desired shape and size, and particularly to a method of controllably producing nanocrystalline chips.

Abstract translation: 一种用于在加工过程中有意诱导调制的刀架组件和方法。 工具架组件被配置为安装在加工装置上的工具块中，并且包括构造成固定到加工装置的工具块上的工具夹主体，安装在工具夹具主体上并构造成用于固定切割 工具，以及用于在工具夹具上施加叠加调制以便相对于工具保持器本体相对于工具移动切割工具的装置。 工具架组件可用于制造具有所需形状和尺寸的切屑的方法，特别是可控地制造纳米晶体芯片的方法。

公开(公告)号：US20060248980A1

公开(公告)日：2006-11-09

申请号：US11381387

申请日：2006-05-03

Applicant: James Mann ,  Srinivasan Chandrasekar ,  Walter Compton

Inventor： James Mann ,  Srinivasan Chandrasekar ,  Walter Compton

IPC: B22F9/00

CPC classification number: B21C23/001 ,  B22F1/0044 ,  B22F9/04 ,  B22F2009/046 ,  B22F2998/10 ,  B22F2999/00 ,  B82Y30/00 ,  C21D7/02 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/42 ,  C22C38/44 ,  C22C38/46 ,  C22C38/52 ,  B22F1/0085 ,  B22F3/14

Abstract: A products having at least a portion thereof with a nanocrystalline microstructure, and methods of producing such products. The method generally entails machining a body to produce a polycrystalline chip having a nanocrystalline microstructure. The chips produced by the machining operation may be in the form of particulates, ribbons, wires, filaments and/or platelets. The chips may be consolidated (with or without comminution) to form a product, such that the product is essentially a nanocrystalline monolithic material consisting essentially or entirely of nano-crystals, or of grains grown from nano-crystals. Alternatively, the chips may be dispersed in a matrix material, such that the product is a composite material in which the chips are dispersed as a reinforcement material. According to a particular aspect, a monolithic article can be formed entirely from a single chip by deforming the chip and/or removing material from the chip.

Abstract translation: 具有至少一部分具有纳米晶体微结构的产品，以及生产这种产品的方法。 该方法通常需要机械加工以制造具有纳米晶体微结构的多晶片。 通过加工操作生产的碎屑可以是颗粒，带状物，丝，丝和/或血小板的形式。 芯片可以被固结（有或没有粉碎）以形成产品，使得产品基本上是由纳米晶体或由纳米晶体生长的晶粒基本上或全部组成的纳米晶体整体材料。 或者，芯片可以分散在基质材料中，使得该产品是其中芯片作为增强材料分散的复合材料。 根据具体方面，通过使芯片变形和/或从芯片上去除材料，整体制品可以由单个芯片完全形成。

公开(公告)号：US20050167008A1

公开(公告)日：2005-08-04

申请号：US10707999

申请日：2004-01-30

Applicant: Srinivasan Chandrasekar ,  Walter Compton ,  Thomas Farris ,  Kevin Trumble

Inventor： Srinivasan Chandrasekar ,  Walter Compton ,  Thomas Farris ,  Kevin Trumble

IPC: B22F1/00 ,  B22F9/00 ,  B22F9/04 ,  C04B20/02 ,  C04B35/622 ,  C22C1/04 ,  C22C49/14 ,  C30B33/00

CPC classification number: B82Y30/00 ,  B22F1/0018 ,  B22F1/0044 ,  B22F9/005 ,  B22F9/04 ,  B22F2001/0033 ,  B22F2998/00 ,  B22F2999/00 ,  C04B20/026 ,  C04B35/622 ,  C04B2235/5454 ,  C04B2235/78 ,  C04B2235/781 ,  C04B2235/785 ,  C22C49/14 ,  C30B29/605 ,  C30B33/00 ,  Y10S75/954 ,  Y10S241/14 ,  C04B20/008 ,  B22F2009/046 ,  C22C1/1036 ,  B22F1/0003 ,  B22F3/10 ,  B22F3/20 ,  B22F3/26 ,  B22F1/0025

Abstract: A product in which at least a portion of the product has a nanocrystalline microstructure, and a method of forming the product. The method generally entails machining a body in a manner that produces chips consisting entirely of nano-crystals as a result of the machining operation imposing a sufficiently large strain deformation. The body can be formed of a variety of materials, including metal, metal alloy and ceramic materials. Furthermore, the body may have a microstructure that is essentially free of nano-crystals, and may even have a single-crystal microstructure. The chips produced by the machining operation may be in the form of particulates, ribbons, wires, filaments and/or platelets. The chips are then used to form the product. According to one aspect of the invention, the chips are consolidated to form the product, such that the product is a monolithic material that may contain nano-crystals. According to another aspect of the invention, the chips are dispersed in a matrix material, such that the product is a composite material in which the chips serve as a reinforcement material.

Abstract translation: 其中至少一部分产品具有纳米晶体微结构的产品，以及形成该产品的方法。 该方法通常需要以通过施加足够大的应变变形的加工操作的结果产生完全由纳米晶体组成的芯片的方式来加工主体。 身体可以由各种材料形成，包括金属，金属合金和陶瓷材料。 此外，主体可以具有基本上不含纳米晶体的微结构，并且甚至可以具有单晶微结构。 通过加工操作生产的碎屑可以是颗粒，带状物，丝，丝和/或血小板的形式。 然后将芯片用于形成产品。 根据本发明的一个方面，将芯片固结形成产品，使得该产品是可以包含纳米晶体的整体材料。 根据本发明的另一方面，芯片分散在基质材料中，使得该产品是其中芯片用作增强材料的复合材料。