公开(公告)号：US20100133558A1

公开(公告)日：2010-06-03

申请号：US12700853

申请日：2010-02-05

Applicant: JEFFREY CHEN ,  CHUNG ZEN LIN

Inventor： JEFFREY CHEN ,  CHUNG ZEN LIN

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type UP lighting devices.

Abstract translation: 一种倒装芯片型LED照明装置的制造方法，其特征在于，包括提供条带的步骤，提供基座的步骤，在所述条带或基台上形成金属接合层的步骤，将所述基台接合在所述带上的工序， 将由此获得的结构切割成单独的倒装芯片型UP照明装置的步骤。