公开(公告)号：US20040005846A1

公开(公告)日：2004-01-08

申请号：US10446118

申请日：2003-05-28

申请人： JATCO Ltd.

发明人： Kazuyuki Hosoe ,  Takefumi Suzuki

IPC分类号： B24B001/00 ,  B24B021/00

CPC分类号： F16G5/16 ,  B24B9/00 ,  B24B19/26 ,  B24B21/002 ,  B24B47/04

摘要： Chamfer processing is carried out by making plate material W end faces come in contact with rotating grinding belts. The grinding surfaces of the opposing side by side grinding belts are on the centerline in the thickness direction of the plate material. The center point is considered the pivot point as seen from the plate material end faces and in distance is smaller than the thickness of the plate material. Pivot motion of the plate material is carried out in the rotating direction of grinding belts. This chamfer processing method and device enables chamfer in a small curvature radius without applying a heavy tension load on grinding belts, and performs uniform deep chamfer processing of multiple plate material simultaneously.

摘要翻译： 通过使板材W端面与旋转的研磨带接触来进行倒角加工。 相对的并排研磨带的磨削表面在板材的厚度方向上的中心线上。 中心点被认为是从板材端面看的枢轴点，距离小于板材的厚度。 板材的枢轴运动沿研磨带的旋转方向进行。 这种倒角加工方法和装置能够在小的曲率半径上进行倒角，而不会在研磨带上施加重的张力，同时对多个板材进行均匀的深倒角加工。