Process for electroplating a metal strip
    1.
    发明授权
    Process for electroplating a metal strip 失效
    金属带电镀工艺

    公开(公告)号:US5344552A

    公开(公告)日:1994-09-06

    申请号:US947730

    申请日:1992-09-21

    IPC分类号: C25D3/22 C25D7/06 C25D21/12

    CPC分类号: C25D7/0614 C25D3/22

    摘要: According to this process, the strip runs through a bath of at least one electrolytic cell and two metal layers are successively deposited onto its surface by adjusting the current feeding the electrolytic cell so that the average value of the current density at the surface of the strip is less than a value called the limiting diffusion current of the ions of the metal to be deposited. In addition, during the formation of the first metal layer, the current is adjusted so as to prevent the appearance of localized overcurrents at the surface of the strip, it being possible for these overcurrents to exceed the limiting diffusion current. Such a process find particular application for electrogalvanizing.Application to an electrogalvanising process.

    摘要翻译: 根据该方法,带材穿过至少一个电解池的浴槽,并且通过调节馈送电解池的电流将两个金属层依次沉积到其表面上,使得带材表面处的电流密度的平均值 小于称为待沉积金属离子的极限扩散电流的值。 此外,在第一金属层的形成期间,调整电流以防止在带的表面出现局部过电流,这些过电流可能超过限制扩散电流。 这样一个过程特别适用于电镀锌。 应用于电镀锌工艺。